Electrochemical etch-stop in TMAH without externally applied bias

P. J. French, M. Nagao, M. Esashi

Research output: Contribution to journalLetterpeer-review

18 Citations (Scopus)


This paper presents a method for electrochemical etch-stop without the use of an externally applied bias voltage. This greatly simplifies the etch process and enables batch fabrication to be achieved. The process is based on the formation of a wet battery when a gold-chrome/n-type silicon/TMAH construction is formed. Bulk micromachined membranes can therefore be formed using an n-type etch-stop.

Original languageEnglish
Pages (from-to)279-280
Number of pages2
JournalSensors and Actuators, A: Physical
Issue number3
Publication statusPublished - 1996 Sep


  • Electrochemical etch-stop
  • Tetramethyl ammonium hydroxide

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering


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