Electrical resistivity behavior in Pd-Cu-Ni-P metallic glasses and liquids

O. Haruyama; N. Annoshita; Nobuyuki Nishiyama; H. M. Kimura; A. Inoue

doi:10.1016/j.msea.2003.10.041

Electrical resistivity behavior in Pd-Cu-Ni-P metallic glasses and liquids

O. Haruyama, N. Annoshita, Nobuyuki Nishiyama, H. M. Kimura, A. Inoue

Institute for Materials Research (IMR)

Research output: Contribution to journal › Article › peer-review

18 Citations (Scopus)

Abstract

The change in the electrical resistivity with vitrification was examined for Pd₄₀Ni₄₀P₂₀, Pd₄₃Cu₂₇Ni₁₀P₂₀ and Pd_42.5Cu₃₀Ni_7.5P₂₀ melts. Each melt was flux-treated for 6-10 days at 1300K prior to the resistivity experiment. Undercooled liquid regions below the liquidus temperature were about 80 and 200K for Pd₄₀Ni₄₀P₂₀ and Pd₄₃Cu₂₇Ni₁₀P₂₀ melts, respectively. The vitrification succeeded only in a Pd_42.5Cu₃₀Ni_7.5P₂₀ melt. In this case, the resistivity of the melt continued to increase with decreasing temperatures and connected smoothly to the resistivity of the bulk glass through the undercooled liquid region. Two resistivity curves, obtained by cooling the melt and heating the bulk glass, indicated a distinct hysteresis from about 500 to 670K. This may be explained phenomenologically by the free volume quenched on cooling and its approaching towards equilibrium on heating.

Original language	English
Pages (from-to)	288-291
Number of pages	4
Journal	Materials Science and Engineering A
Volume	375-377
Issue number	1-2 SPEC. ISS.
DOIs	https://doi.org/10.1016/j.msea.2003.10.041
Publication status	Published - 2004 Jul 1

Keywords

Bulk glass
Electrical resistivity
Pd-Cu-Ni-P melt
Vitrification

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.1016/j.msea.2003.10.041

Cite this

@article{a6c29c1342be4457958546c4dd9742d8,

title = "Electrical resistivity behavior in Pd-Cu-Ni-P metallic glasses and liquids",

abstract = "The change in the electrical resistivity with vitrification was examined for Pd40Ni40P20, Pd43Cu27Ni10P20 and Pd42.5Cu30Ni7.5P20 melts. Each melt was flux-treated for 6-10 days at 1300K prior to the resistivity experiment. Undercooled liquid regions below the liquidus temperature were about 80 and 200K for Pd40Ni40P20 and Pd43Cu27Ni10P20 melts, respectively. The vitrification succeeded only in a Pd42.5Cu30Ni7.5P20 melt. In this case, the resistivity of the melt continued to increase with decreasing temperatures and connected smoothly to the resistivity of the bulk glass through the undercooled liquid region. Two resistivity curves, obtained by cooling the melt and heating the bulk glass, indicated a distinct hysteresis from about 500 to 670K. This may be explained phenomenologically by the free volume quenched on cooling and its approaching towards equilibrium on heating.",

keywords = "Bulk glass, Electrical resistivity, Pd-Cu-Ni-P melt, Vitrification",

author = "O. Haruyama and N. Annoshita and Nobuyuki Nishiyama and Kimura, {H. M.} and A. Inoue",

year = "2004",

month = jul,

day = "1",

doi = "10.1016/j.msea.2003.10.041",

language = "English",

volume = "375-377",

pages = "288--291",

journal = "Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing",

issn = "0921-5093",

publisher = "Elsevier BV",

number = "1-2 SPEC. ISS.",

}

TY - JOUR

T1 - Electrical resistivity behavior in Pd-Cu-Ni-P metallic glasses and liquids

AU - Haruyama, O.

AU - Annoshita, N.

AU - Nishiyama, Nobuyuki

AU - Kimura, H. M.

AU - Inoue, A.

PY - 2004/7/1

Y1 - 2004/7/1

N2 - The change in the electrical resistivity with vitrification was examined for Pd40Ni40P20, Pd43Cu27Ni10P20 and Pd42.5Cu30Ni7.5P20 melts. Each melt was flux-treated for 6-10 days at 1300K prior to the resistivity experiment. Undercooled liquid regions below the liquidus temperature were about 80 and 200K for Pd40Ni40P20 and Pd43Cu27Ni10P20 melts, respectively. The vitrification succeeded only in a Pd42.5Cu30Ni7.5P20 melt. In this case, the resistivity of the melt continued to increase with decreasing temperatures and connected smoothly to the resistivity of the bulk glass through the undercooled liquid region. Two resistivity curves, obtained by cooling the melt and heating the bulk glass, indicated a distinct hysteresis from about 500 to 670K. This may be explained phenomenologically by the free volume quenched on cooling and its approaching towards equilibrium on heating.

AB - The change in the electrical resistivity with vitrification was examined for Pd40Ni40P20, Pd43Cu27Ni10P20 and Pd42.5Cu30Ni7.5P20 melts. Each melt was flux-treated for 6-10 days at 1300K prior to the resistivity experiment. Undercooled liquid regions below the liquidus temperature were about 80 and 200K for Pd40Ni40P20 and Pd43Cu27Ni10P20 melts, respectively. The vitrification succeeded only in a Pd42.5Cu30Ni7.5P20 melt. In this case, the resistivity of the melt continued to increase with decreasing temperatures and connected smoothly to the resistivity of the bulk glass through the undercooled liquid region. Two resistivity curves, obtained by cooling the melt and heating the bulk glass, indicated a distinct hysteresis from about 500 to 670K. This may be explained phenomenologically by the free volume quenched on cooling and its approaching towards equilibrium on heating.

KW - Bulk glass

KW - Electrical resistivity

KW - Pd-Cu-Ni-P melt

KW - Vitrification

UR - http://www.scopus.com/inward/record.url?scp=3142759389&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=3142759389&partnerID=8YFLogxK

U2 - 10.1016/j.msea.2003.10.041

DO - 10.1016/j.msea.2003.10.041

M3 - Article

AN - SCOPUS:3142759389

VL - 375-377

SP - 288

EP - 291

JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

SN - 0921-5093

IS - 1-2 SPEC. ISS.

ER -

Electrical resistivity behavior in Pd-Cu-Ni-P metallic glasses and liquids

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this