Electrical and thermal conductivities in quenched and aged high-purity Cu-Ti alloys

Shigeru Suzuki, K. Hirabayashi, Hiroyuki Shibata, Koji Mimura, M. Isshiki, Y. Waseda

Research output: Contribution to journalArticle

65 Citations (Scopus)

Abstract

The electrical and thermal conductivities in quenched and aged high-purity Cu-Ti alloys were discussed. It was found that the electrical and thermal conductivities increased as aging time at 720 K increased which indicated that the precipitation takes place in these alloys. The analysis showed positive correlations between the electrical and thermal conductivities in each aged Cu-Ti alloys.

Original languageEnglish
Pages (from-to)431-435
Number of pages5
JournalScripta Materialia
Volume48
Issue number4
DOIs
Publication statusPublished - 2003 Feb 1

Keywords

  • Aging
  • Electrical conductivity
  • High-purity copper-titanium alloys
  • Thermal conductivity

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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