Effects of minor Si addition on glass formation and thermal stability of Ni free Ti-based bulk metallic glass

Shengli Zhu, Guoqiang Xie, Fengxiang Qin, Xinmin Wang

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    6 Citations (Scopus)

    Abstract

    The effects of small amounts of Si on the glass-forming ability, thermal stability and mechanical property of a TiZrCuPdSn bulk metallic glass were investigated. The addition of Si caused the decrease of glass-forming ability and the enlarging of the supercooled liquid (SCL) region. With 2 at.% Si addition, a significant SCL region of 80 K was obtained, which indicated high thermal stability of the glassy alloy and was in favor of secondary working by viscous flow deformation. With increasing Si content, the plasticity decreased.

    Original languageEnglish
    Title of host publicationAdvanced Materials Science and Technology
    PublisherTrans Tech Publications Ltd
    Pages36-39
    Number of pages4
    ISBN (Print)9783037856604
    DOIs
    Publication statusPublished - 2013 Jan 1
    Event8th International Forum on Advanced Materials Science and Technology, IFAMST 2012 - Fukuoka City, Japan
    Duration: 2012 Aug 12012 Aug 4

    Publication series

    NameMaterials Science Forum
    Volume750
    ISSN (Print)0255-5476
    ISSN (Electronic)1662-9752

    Other

    Other8th International Forum on Advanced Materials Science and Technology, IFAMST 2012
    CountryJapan
    CityFukuoka City
    Period12/8/112/8/4

    Keywords

    • Biomaterial
    • Bulk metallic glass
    • Glass-forming ability
    • Minor element addition
    • Thermal stability

    ASJC Scopus subject areas

    • Materials Science(all)
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering

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  • Cite this

    Zhu, S., Xie, G., Qin, F., & Wang, X. (2013). Effects of minor Si addition on glass formation and thermal stability of Ni free Ti-based bulk metallic glass. In Advanced Materials Science and Technology (pp. 36-39). (Materials Science Forum; Vol. 750). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.750.36