TY - GEN
T1 - Effects of filler atoms on lattice thermal conductivity of RyFexCo4-xSb12 (R=Ba, Ce, Y)
AU - Tang, X. F.
AU - Chen, L. D.
AU - Zhang, Q. J.
AU - Goto, T.
AU - Hirai, T.
AU - Yuan, R. Z.
N1 - Publisher Copyright:
© 2003 IEEE.
PY - 2003
Y1 - 2003
N2 - Effects of filler atoms with different ionic radii Ba, Ce, Y on the lattice thermal conductivity of filled RyFexCo4-xSb12 are systematically investigated. The results show that the lattice thermal conductivity decreases significantly by filling Ba, Ce, Y atoms in Sb-icosahedral voids, and the reducing range of the lattice thermal conductivity increases in order of ionic radii decreasing from Ba2+, Ce3+ to Y3+. The lowest lattice thermal conductivity and strongest rattling actions of filler atoms with respect to scattering of phonons are gained when the Sb-icosahedral voids are partly filled.
AB - Effects of filler atoms with different ionic radii Ba, Ce, Y on the lattice thermal conductivity of filled RyFexCo4-xSb12 are systematically investigated. The results show that the lattice thermal conductivity decreases significantly by filling Ba, Ce, Y atoms in Sb-icosahedral voids, and the reducing range of the lattice thermal conductivity increases in order of ionic radii decreasing from Ba2+, Ce3+ to Y3+. The lowest lattice thermal conductivity and strongest rattling actions of filler atoms with respect to scattering of phonons are gained when the Sb-icosahedral voids are partly filled.
KW - Atmospheric measurements
KW - Atomic measurements
KW - Conducting materials
KW - Conductivity measurement
KW - Filling
KW - Iron
KW - Lattices
KW - Plasma measurements
KW - Thermal conductivity
KW - Thermoelectricity
UR - http://www.scopus.com/inward/record.url?scp=84946028923&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84946028923&partnerID=8YFLogxK
U2 - 10.1109/ICT.2003.1287460
DO - 10.1109/ICT.2003.1287460
M3 - Conference contribution
AN - SCOPUS:84946028923
T3 - International Conference on Thermoelectrics, ICT, Proceedings
SP - 105
EP - 108
BT - Proceedings ICT 2003 - 22nd International Conference on Thermoelectrics
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd International Conference on Thermoelectrics, ICT 2003
Y2 - 17 August 2003 through 21 August 2003
ER -