Effects of environmental factors on the electronic properties of interfacial oxide film on 304L stainless steel in high temperature pure water

Zhanpeng Lu, Yoichi Takeda, Tetsuo Shoji

Research output: Contribution to journalConference articlepeer-review

4 Citations (Scopus)


The electronic properties of the interfacial oxide film formed on 304L stainless steel in high temperature water are investigated by contact electric resistance (CER) measurements. Tests are performed in pure water with a wide range of dissolved oxygen (DO) content at 200, 250, and 288°C. The electrochemical potential (ECP) moves in the noble direction and CER increases when increasing DO. Results show that DO content has a dominant effect on the electronic properties of oxide film. The change of oxide film properties can also be attributed to the variation of the electrochemical potential, which is directly affected by DO content. Critical potentials exist for the formation and reduction of oxide films in high temperature water. Multiple steps are found for the reduction of oxide films due to de-aeration in 200, 250, and 288°C water, implying the presence of multiple-layer interfacial oxide films. The film reduction process is relatively slower than the film formation process. Present results show that even in high purity water, a moderate change of DO content can result in different surface conditions. Dissolved hydrogen has a moderate effect on interfacial surface films in deaerated water. In-situ monitoring of the oxide film properties by CER technique provides information on the interfacial reactions that are related to the SCC behavior of materials in high temperature water environments.

Original languageEnglish
Pages (from-to)919-924
Number of pages6
JournalKey Engineering Materials
Issue numberII
Publication statusPublished - 2004
EventAdvances in Fracture and Failure Prevention: Proceedings of the Fifth International Conference on Fracture and Strength of Solids (FEOFS2003): Second International Conference on Physics and Chemistry of Fracture and Failure Prevention (2nd ICPCF) - Sendai, Japan
Duration: 2003 Oct 202003 Oct 22


  • Boiling water reactor
  • Contact electric resistance
  • Dissolved oxygen content
  • Electrochemical potential
  • High temperature water
  • Oxide film
  • Stress corrosion cracking

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering


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