Effects of corner position and operating condition on electromigration failure in angled bamboo lines without passivation layer

K. Sasagawa, M. Hasegawa, K. Naito, M. Saka, H. Abé

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)

Abstract

The atomic flux divergence due to electromigration, AFDgen, has been formulated considering two-dimensional distributions of current density and temperature within polycrystalline and bamboo line structures without passivation. The divergence AFDgen has been identified as a governing parameter of electromigration damage by experimental verification. Recently, an AFDgen-based method for predicting the lifetime and failure site in an unpassivated bamboo line was proposed based on numerical simulation of the failure process of a metal line. Availing of the advantage of the universal method, the effects of corner position, corner angle and operating conditions on the lifetime and failure location in angled metal lines are discussed. The lifetime and failure location varied with the line shape and operating conditions. Understanding these effects on metal line failure gives important knowledge for enhancing the electromigration endurance of metal lines.

Original languageEnglish
Pages (from-to)255-266
Number of pages12
JournalThin Solid Films
Volume401
Issue number1-2
DOIs
Publication statusPublished - 2001 Dec 17

Keywords

  • Aluminum
  • Computer simulation
  • Electromigration
  • Failure prediction

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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