Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures

Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Since the thickness of the stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the thermal residual stress distribution appear in the stacked chips due to the periodic alignment of metallic bumps, and they deteriorate the reliability of products. In this paper, the dominant structural factors of the local deformation of a silicon chip are discussed quantitatively based on the results of a three-dimensional finite element analysis and the measurement of the local deformation and residual stress in a chip using strain sensor chips and interference microscopy.

Original languageEnglish
Title of host publication2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
DOIs
Publication statusPublished - 2010 Jun 24
Event2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 - Bordeaux, France
Duration: 2010 Apr 262010 Apr 28

Publication series

Name2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

Other

Other2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
CountryFrance
CityBordeaux
Period10/4/2610/4/28

ASJC Scopus subject areas

  • Computational Theory and Mathematics
  • Electrical and Electronic Engineering
  • Theoretical Computer Science

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