TY - GEN
T1 - Effect of the lattice mismatch between copper thin-film interconnection and base material on the crystallinity of the interconnection
AU - Fan, Chuanhong
AU - Asai, Osamu
AU - Suzuki, Ken
AU - Miura, Hideo
PY - 2012/12/1
Y1 - 2012/12/1
N2 - Electroplated copper thin films have become indispensable for the interconnections in next-generation semiconductor devices because of its low electric resistivity and high thermal conductivity. Since the electrical properties of the electroplated copper thin films vary drastically depending on their micro texture, the effect of the base layer material (a copper diffusion preventing layer and an electroplating seed layer) on the crystallinity of the electroplated copper thin films was investigated quantitatively in order to assure and improve the performance and reliability of electroplated copper thin-film interconnections.
AB - Electroplated copper thin films have become indispensable for the interconnections in next-generation semiconductor devices because of its low electric resistivity and high thermal conductivity. Since the electrical properties of the electroplated copper thin films vary drastically depending on their micro texture, the effect of the base layer material (a copper diffusion preventing layer and an electroplating seed layer) on the crystallinity of the electroplated copper thin films was investigated quantitatively in order to assure and improve the performance and reliability of electroplated copper thin-film interconnections.
UR - http://www.scopus.com/inward/record.url?scp=84880254229&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84880254229&partnerID=8YFLogxK
U2 - 10.1109/EMAP.2012.6507865
DO - 10.1109/EMAP.2012.6507865
M3 - Conference contribution
AN - SCOPUS:84880254229
SN - 9781467349444
T3 - 14th International Conference on Electronic Materials and Packaging, EMAP 2012
BT - 14th International Conference on Electronic Materials and Packaging, EMAP 2012
T2 - 14th International Conference on Electronic Materials and Packaging, EMAP 2012
Y2 - 13 December 2012 through 16 December 2012
ER -