Effect of the lattice mismatch between copper thin-film interconnection and base material on the crystallinity of the interconnection

Chuanhong Fan, Osamu Asai, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Electroplated copper thin films have become indispensable for the interconnections in next-generation semiconductor devices because of its low electric resistivity and high thermal conductivity. Since the electrical properties of the electroplated copper thin films vary drastically depending on their micro texture, the effect of the base layer material (a copper diffusion preventing layer and an electroplating seed layer) on the crystallinity of the electroplated copper thin films was investigated quantitatively in order to assure and improve the performance and reliability of electroplated copper thin-film interconnections.

Original languageEnglish
Title of host publication14th International Conference on Electronic Materials and Packaging, EMAP 2012
DOIs
Publication statusPublished - 2012 Dec 1
Event14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong
Duration: 2012 Dec 132012 Dec 16

Publication series

Name14th International Conference on Electronic Materials and Packaging, EMAP 2012

Other

Other14th International Conference on Electronic Materials and Packaging, EMAP 2012
CountryHong Kong
CityLantau Island
Period12/12/1312/12/16

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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