Effect of the crystallinity on the long-term reliability of electroplated copper thin-film interconnections

Takeru Kato, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this study, the crystallinity of electroplated copper thin-film interconnections on Cu and Ru seed layers before and after EM (Electro migration) test was evaluated by an EBSD (Electron Back-scattered Diffraction). The EM resistance of the interconnection on the Ru seed layer was improved drastically compared with that on the Cu one. EBSD analyses revealed that the crystallinity of the interconnection on the Ru seed layer was much higher than that on the Cu one. In particular, the density of random grain boundaries with low crystallinity decreased in the interconnection on the Ru seed layer. It was concluded, therefore, that the improvement of the crystallinity of the electroplated copper thin-film interconnection by using the seed layer that can reduce the lattice mismatch between Cu and a barrier layer material is effective for assuring the high EM resistance and thus, the long-term reliability of the interconnection.

Original languageEnglish
Title of host publication2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Subtitle of host publicationChallenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages359-362
Number of pages4
ISBN (Electronic)9781479977277
DOIs
Publication statusPublished - 2014
Event9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan, Province of China
Duration: 2014 Oct 222014 Oct 24

Publication series

Name2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Other

Other9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
CountryTaiwan, Province of China
CityTaipei
Period14/10/2214/10/24

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

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