Effect of the crystallinity of a grain boundary on the self-diffusion of copper in thin-film interconnections

Hayato Sakamoto, Takeru Kato, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, the effect of the crystallinity and the characteristics of grain boundaries on the grain boundary diffusion was investigated experimentally. The crystallinity and characteristics of the grain boundaries were evaluated by using an EBSD (Electron Back-scattered Diffraction) method. The atomic diffusion of the grain boundary was also observed as the change of the surface morphology of interconnections by SPM (Scanning Probe Microscopy). It was found that the main diffusion paths during EM (Electro Migration) was random grain boundaries. The grain boundaries with low quality, regardless of crystallographic orientation, were also the main atomic diffusion paths.

Original languageEnglish
Title of host publication2016 IEEE 37th International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509034437
DOIs
Publication statusPublished - 2016 Nov 28
Event37th IEEE International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016 - Georgetown, Penang, Malaysia
Duration: 2016 Sep 202016 Sep 22

Publication series

NameProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
Volume2016-November
ISSN (Print)1089-8190

Other

Other37th IEEE International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016
CountryMalaysia
CityGeorgetown, Penang
Period16/9/2016/9/22

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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