Effect of surface oxide films on the properties of pulse electric-current sintered metal powders

Guoqiang Xie, Osamu Ohashi, Norio Yamaguchi, Airu Wang

    Research output: Contribution to journalArticle

    34 Citations (Scopus)

    Abstract

    Metallic powders with various thermodynamic stability oxide films (Ag, Cu, and Al powders) were sintered using a pulse electric-current sintering (PECS) process. Behavior of oxide films at powder surfaces and their effect on the sintering properties were investigated. The results showed that the sintering properties of metallic powders in the PECS process were subject to the thermodynamic stability of oxide films at particles surfaces. The oxide films at Ag powder surfaces are decomposed during sintering with the contact region between the particles being metal/metal bond. The oxide films at Cu powder surfaces are mainly broken via loading pressure at a low sintering temperature. At a high sintering temperature, they are mainly dissolved in the parent metal, and the contact regions turn into the direct metal/metal bonding. Excellent sintering properties can be received. The oxide films at Al powder surfaces are very stable, and cannot be decomposed and dissolved, but broken by plastic deformation of particles under loading pressure at experimental temperatures. The interface between particles is partially bonded via the direct metal/metal bonding making it difficult to achieve good sintered properties.

    Original languageEnglish
    Pages (from-to)2655-2661
    Number of pages7
    JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
    Volume34 A
    Issue number11
    DOIs
    Publication statusPublished - 2003 Nov

    ASJC Scopus subject areas

    • Condensed Matter Physics
    • Mechanics of Materials
    • Metals and Alloys

    Fingerprint Dive into the research topics of 'Effect of surface oxide films on the properties of pulse electric-current sintered metal powders'. Together they form a unique fingerprint.

  • Cite this