Effect of process temperature of Al2O3 atomic layer deposition using accurate process gasses supply system

H. Sugita, Y. Koda, T. Suwa, R. Kuroda, T. Goto, H. Ishii, S. Yamashita, A. Teramoto, S. Sugawa, T. Ohmi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Al2O3 is one of the most important high-k materials for high density on-chip metal-insulator-metal (MIM) capacitors as well as gate insulator for semiconductor power devices. In this paper, using the developed atomic layer deposition (ALD) process equipment with multiple oxidation methods and accurate process gas supply system adapted to high temperature usage, the impact of the process temperature on the electrical characteristics of Al2O3 films was investigated. It was found that the substrate material must not be oxidized at the trimethylaluminum (TMA) - oxidation step of ALD. An excessive high temperature may cause decomposition of TMA, so the process temperature should be controlled sufficiently low in order to obtain one layer TMA adsorbing on the wafer. However, this tends to cause lowering oxidation ability, so it is necessary to remove carbon in the Al2O3 films after the ALD. Post ALD process, such as post deposition anneal (PDA) is required.

Original languageEnglish
Title of host publicationSilicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5
EditorsF. Roozeboom, V. Narayanan, K. Kakushima, P. J. Timans, E. P. Gusev, Z. Karim, S. DeGendt
PublisherElectrochemical Society Inc.
Pages305-314
Number of pages10
Edition4
ISBN (Electronic)9781607685395
DOIs
Publication statusPublished - 2015 Jan 1
EventSymposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5 - 227th ECS Meeting - Chicago, United States
Duration: 2015 May 242015 May 28

Publication series

NameECS Transactions
Number4
Volume66
ISSN (Print)1938-6737
ISSN (Electronic)1938-5862

Other

OtherSymposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5 - 227th ECS Meeting
CountryUnited States
CityChicago
Period15/5/2415/5/28

ASJC Scopus subject areas

  • Engineering(all)

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