Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints

Kyoung Ho Kim, Junichi Koike, Jeong Won Yoon, Sehoon Yoo

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

The wetting behavior, interfacial reactions, and mechanical reliability of Sn-Ag-Cu solder on a plasma-coated printed circuit board (PCB) substrate were evaluated under multiple heat-treatments. Conventional organic solderability preservative (OSP) finished PCBs were used as a reference. The plasma process created a dense and highly cross-linked polymer coating on the Cu substrates. The plasma finished samples had higher wetting forces and shorter zero-cross times than those with OSP surface finish. The OSP sample was degraded after sequential multiple heat treatments and reflow processes, whereas the solderability of the plasma finished sample was retained after multiple heat treatments. After the soldering process, similar microstructures were observed at the interfaces of the two solder joints, where the development of intermetallic compounds was observed. From ball shear tests, it was found that the shear force for the plasma substrate was consistently higher than that for the OSP substrate. Deterioration of the OSP surface finish was observed after multiple heat treatments. Overall, the plasma surface finish was superior to the conventional OSP finish with respect to wettability and joint reliability, indicating that it is a suitable material for the fabrication of complex electronic devices.

Original languageEnglish
Pages (from-to)6184-6191
Number of pages8
JournalJournal of Electronic Materials
Volume45
Issue number12
DOIs
Publication statusPublished - 2016 Dec 1

Keywords

  • Pb-free solder
  • Plasma surface finish
  • Sn-3.0Ag-0.5Cu
  • mechanical properties
  • wettability

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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