Effect of packaging stress in a laser chip on its radiation spectrum

Atsushi Kitamura, Taira Kawauchi, Ken Suzuki, Hideo Miura, Minoru Sasaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A wavelength division multiplexing system is a basic infrastructure for the next coming optical fiber network. Since the band gap of a laser chip that determines the wavelength of a radiated laser beam is varied by strain in a laser chip, packaging-induced stress may change a radiation spectrum of a mounted laser chip. The final residual strain in an active layer of a laser chip varies significantly depending on the thin film deposition process for interconnections and mirrors, and thus, changes the radiation spectrum of the laser chip. Thus, the change of residual stress caused by packaging was analyzed by a finite element method. The estimated change reached about several hundreds MPa depending on materials of a substrate, adhesion material, and deflection of the package. In order to confirm the effect of such an additional strain on a radiation spectrum of a laser beam, mechanical stress (strain) was applied directly to a laser chip and the change of the spectrum of the laser chip under the applied strain was measured. A four-point bending test was used for applying mechanical stress to a laser chip. It was confirmed that the radiation spectrum of a laser chip, such as wavelength and width of the spectrum, changes almost linearly with the amplitude of the applied uniaxial strain. The wavelength of the laser chip decreased and a width of the spectrum of the laser chip at the threshold current increased with the increase of the magnitude of the applied strain. The change rate of the wavelength was about 0.4-nm/micro-strain. Therefore, it is very important to control the final residual stress or strain in an active layer of a laser chip to assure the precise optical characteristics of the laser chip.

Original languageEnglish
Title of host publication2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Pages687-692
Number of pages6
DOIs
Publication statusPublished - 2007 Dec 1
EventASME Electronic and Photonics Packaging Division - Vancouver, BC, United States
Duration: 2007 Jul 82007 Jul 12

Publication series

Name2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume2

Other

OtherASME Electronic and Photonics Packaging Division
CountryUnited States
CityVancouver, BC
Period07/7/807/7/12

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Information Systems

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  • Cite this

    Kitamura, A., Kawauchi, T., Suzuki, K., Miura, H., & Sasaki, M. (2007). Effect of packaging stress in a laser chip on its radiation spectrum. In 2007 Proceedings of the ASME InterPack Conference, IPACK 2007 (pp. 687-692). (2007 Proceedings of the ASME InterPack Conference, IPACK 2007; Vol. 2). https://doi.org/10.1115/IPACK2007-33262