Effect of molecular structure of scavengers on copper diffusion deterrence in low k film

Yutaka Nomura, Daisuke Ryuzaki, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)


Low k material with high deterrence ability of copper diffusion has been proposed to reduce the effective electrical resistance of copper wirings. Providing organic low k material with deterrence ability was attempted by adding a chemical agent that chemically combines with copper. The insulation lifetime of the low k film with benzotriazole (BTA) as the copper scavenger was about two orders of magnitude higher than that of BTA-free low k film, at the practical electric field strength of 0.1 MV/cm. The copper diffusion deterrence ability was clearly dependent on the ability of the copper scavenger.

Original languageEnglish
Title of host publicationSmart Dielectric Polymer Properties, Characterization and Their Devices
Number of pages6
Publication statusPublished - 2006 Dec 1
Event2006 MRS Fall Meeting - Boston, MA, United States
Duration: 2006 Nov 272006 Nov 29

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


Other2006 MRS Fall Meeting
Country/TerritoryUnited States
CityBoston, MA

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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