Effect of molecular structure of scavengers on copper diffusion deterrence in low k film

Yutaka Nomura, Daisuke Ryuzaki, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Low k material with high deterrence ability of copper diffusion has been proposed to reduce the effective electrical resistance of copper wirings. Providing organic low k material with deterrence ability was attempted by adding a chemical agent that chemically combines with copper. The insulation lifetime of the low k film with benzotriazole (BTA) as the copper scavenger was about two orders of magnitude higher than that of BTA-free low k film, at the practical electric field strength of 0.1 MV/cm. The copper diffusion deterrence ability was clearly dependent on the ability of the copper scavenger.

Original languageEnglish
Title of host publicationSmart Dielectric Polymer Properties, Characterization and Their Devices
Pages50-55
Number of pages6
Publication statusPublished - 2006 Dec 1
Event2006 MRS Fall Meeting - Boston, MA, United States
Duration: 2006 Nov 272006 Nov 29

Publication series

NameMaterials Research Society Symposium Proceedings
Volume949
ISSN (Print)0272-9172

Other

Other2006 MRS Fall Meeting
CountryUnited States
CityBoston, MA
Period06/11/2706/11/29

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Effect of molecular structure of scavengers on copper diffusion deterrence in low k film'. Together they form a unique fingerprint.

Cite this