Effect of microstructure on the characterization of creep crack growth rate and rupture in TiAl intermetallic alloys

Akio Fuji, Toshimitsu Yokobori, Mizuki Kikuchi, Masaaki Tabuchi, Takeo Yokobori

    Research output: Contribution to journalArticlepeer-review

    6 Citations (Scopus)

    Abstract

    In order to establish a standardised method of creep crack growth testing for creep brittle materials, Round Robin tests and analysis of the results were carried out using a TiAl alloy material tested at 750 °C. The TiAl intermetallic contained two different microstructures; one is fully lamellar TiAl and the other fine-grained TiAl. It is found from the results in the Round Robin tests that these materials show creep crack growth different behaviour. In the present study, the characteristics of creep crack growth rate and their rupture lives are considered. It is shown that the characterization of the creep crack growth and the specimen failure lives using the Q* parameter, Larson-Miller parameter and creep ductility criteria are all possible.

    Original languageEnglish
    Pages (from-to)435-440
    Number of pages6
    JournalInternational Journal of Pressure Vessels and Piping
    Volume80
    Issue number7-8
    DOIs
    Publication statusPublished - 2003 Sep 1

    Keywords

    • Creep crack growth
    • Creep ductility
    • Creep life prediction
    • Q parameter
    • Round Robin test
    • TiAl intermetallic compound

    ASJC Scopus subject areas

    • Materials Science(all)
    • Mechanics of Materials
    • Mechanical Engineering

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