Abstract
The effect of mechanical stress on the initial and time-dependent dielectric breakdown characteristics of gate-oxide films in MOS transistors was measured by changing the stress field in both silicon substrates and in the thin films used for the gate electrodes. The initial breakdown failure rate decreases monotonically as internal stress in the gate electrodes is reduced. On the other hand, there is a critical stress beyond which the average lifetime of time-dependent breakdown failure decreases to less than a tenth.
Original language | English |
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Pages (from-to) | 743-746 |
Number of pages | 4 |
Journal | Technical Digest - International Electron Devices Meeting, IEDM |
DOIs | |
Publication status | Published - 1996 |
Externally published | Yes |
Event | Proceedings of the 1996 IEEE International Electron Devices Meeting - San Francisco, CA, USA Duration: 1996 Dec 8 → 1996 Dec 11 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry