Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC

Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Research output: Contribution to journalArticle

3 Citations (Scopus)

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Physics & Astronomy

Engineering & Materials Science