Effect of line-shape on threshold current density of electromigration damage in bamboo lines

Kazuhiko Sasagawa, Shigeo Uno, Nao Yamaji, Masumi Saka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

It is known that there is the threshold current density of the electromigration damage in the via-connected line. The evaluation of the threshold current density is one of the great interests from the viewpoint of IC reliability. In this study, a metal line with two-dimensional shape, i.e. an angled metal line is treated. The evaluation method of the threshold current density is applied to the metal line. The method is based on the numerical simulation of the building-up process of the atomic density distribution in the bamboo line by using the governing parameter for electromigration damage. Comparing the evaluated results with that of straight-shaped line, the effect of line-shape on threshold current density of electromigration damage is discussed. Furthermore, the obtained difference in the threshold current density is verified experimentally.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
PublisherAmerican Society of Mechanical Engineers
Pages1147-1152
Number of pages6
ISBN (Print)0791842002, 9780791842003
DOIs
Publication statusPublished - 2005 Jan 1
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: 2005 Jul 172005 Jul 22

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART B

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
CountryUnited States
CitySan Francisco, CA
Period05/7/1705/7/22

ASJC Scopus subject areas

  • Engineering(all)

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    Sasagawa, K., Uno, S., Yamaji, N., & Saka, M. (2005). Effect of line-shape on threshold current density of electromigration damage in bamboo lines. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (pp. 1147-1152). (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; Vol. PART B). American Society of Mechanical Engineers. https://doi.org/10.1115/ipack2005-73133