Effect of grain boundaries on isothermal solidification during transient liquid phase brazing

Hiroyuki Kokawa, C. H. Lee, T. H. North

Research output: Contribution to journalArticlepeer-review

58 Citations (Scopus)

Abstract

The influence of liquid penetration at grain boundary regions on the rate of advance of the solid-liquid interface during isothermal solidification of transient liquid phase (TLP) brazed nickel joints has been examined. The test samples used in this study were Ohno-cast nickel with a grain size of >4 mm and a fine-grained nickel with a grain size of around 40 μm. Both Ni-base materials had the same chemical composition. The rate of isothermal solidification was greater when fine-grained nickel was employed during TLP brazing using Ni-11 wt pct P filler metal at 1200 °C. Liquid penetration at grain boundaries accelerates the isothermal solidification process by increasing the effective solid-liquid interfacial area and increasing the rate of solute diffusion into the base material. An analysis of electron channeling patterns has confirmed that random high-angle boundaries have a greater influence on the rate of isothermal solidification than ordered boundaries including small-angle or twin boundaries.

Original languageEnglish
Pages (from-to)1627-1631
Number of pages5
JournalMetallurgical Transactions A
Volume22
Issue number7
DOIs
Publication statusPublished - 1991 Jul 1

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

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