Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Yingqiong Yong, Mai Thanh Nguyen, Hiroki Tsukamoto, Masaki Matsubara, Ying Chih Liao, Tetsu Yonezawa

Research output: Contribution to journalArticlepeer-review

19 Citations (Scopus)

Abstract

Mixtures of a copper complex and copper fine particles as copper-based metal-organic decomposition (MOD) dispersions have been demonstrated to be effective for low-temperature sintering of conductive copper film. However, the copper particle size effect on decomposition process of the dispersion during heating and the effect of organic residues on the resistivity have not been studied. In this study, the decomposition process of dispersions containing mixtures of a copper complex and copper particles with various sizes was studied. The effect of organic residues on the resistivity was also studied using thermogravimetric analysis. In addition, the choice of copper salts in the copper complex was also discussed. In this work, a low-resistivity sintered copper film (7 × 10-6 ω·m) at a temperature as low as 100 °C was achieved without using any reductive gas.

Original languageEnglish
Article number45150
JournalScientific reports
Volume7
DOIs
Publication statusPublished - 2017 Mar 24
Externally publishedYes

ASJC Scopus subject areas

  • General

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