Effect of Cu addition on coercivity and interfacial state of Nd-Fe-B/Nd-rich thin films

M. Matsuura, S. Sugimoto, T. Fukada, R. Goto, N. Tezuka

Research output: Contribution to journalConference articlepeer-review

9 Citations (Scopus)

Abstract

This study provides the effect of Cu addition on coercivity (H cJ) and interfacial microstructure in Nd-Fe-B/Nd-rich thin films. All films were deposited by using ultra high vacuum (UHV) magnetron sputtering, and the Nd-Fe-B layer was oxidized under several atmospheres with different oxygen content. Then, the films were annealed at 250-550 °C under UHV. The films oxidized in low vacuum (10-2-10-5 Pa) (under low oxygen state) exhibited the recovery of HcJ by the annealing at 450 °C. On the contrary, the HcJ of the films oxidized in Ar (under high oxygen state) decreased with increasing annealing temperature. However, the HcJ increased drastically at the temperatures above 550 °C. In addition, the Cu added films, which were annealed at temperatures above 350 °C, showed higher coercivities than the films without Cu addition. The XRD analysis suggested the existence of C-Nd2O3 phase in the Cu added films annealed at 550 °C. It can be considered that the Cu addition decreases the eutectic temperature of Nd-rich phase and influences the interfacial state between Nd2Fe14B and Nd-rich phase.

Original languageEnglish
Article number082019
JournalJournal of Physics: Conference Series
Volume200
Issue numberSECTION 8
DOIs
Publication statusPublished - 2010 Jan 1

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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