Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump

Shoho Ishikawa; Hironori Tohmyoh; Masumi Saka; Satoshi Watanabe; Motohisa Kuroha; Yoshikatsu Nakano

doi:10.1115/IPACK2011-52112

Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump

Shoho Ishikawa, Hironori Tohmyoh, Masumi Saka, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano

ENG - Finemechanics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Due to environmental concerns, Pb-free solders are widely used in electronic industry for assembling electronic components on the substrate. Under the various operation conditions, solder bumps are subjected to cyclic stress and failed by fatigue. To ensure the reliability of electronic products, it is becoming important to predict the fatigue failure of the Pb-free solder bumps. In this study, effects of chip size and thermal amplitude on fatigue life of the Pb-free solder bumps were investigated by experiments and elastic-plastic finite element analysis. A parameter, which is valuable to compare the fatigue damage of electronic packages with different chip size, is introduced.

Original language	English
Title of host publication	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Pages	207-211
Number of pages	5
DOIs	https://doi.org/10.1115/IPACK2011-52112
Publication status	Published - 2011 Dec 1
Event	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States Duration: 2011 Jul 6 → 2011 Jul 8

Publication series

Name	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume	1

Other

Other	ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Country	United States
City	Portland, OR
Period	11/7/6 → 11/7/8

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1115/IPACK2011-52112

Fingerprint Dive into the research topics of 'Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump'. Together they form a unique fingerprint.

Cite this

Ishikawa, S., Tohmyoh, H., Saka, M., Watanabe, S., Kuroha, M., & Nakano, Y. (2011). Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (pp. 207-211). (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 1). https://doi.org/10.1115/IPACK2011-52112

Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump. / Ishikawa, Shoho; Tohmyoh, Hironori; Saka, Masumi; Watanabe, Satoshi; Kuroha, Motohisa; Nakano, Yoshikatsu.

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. p. 207-211 (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ishikawa, S, Tohmyoh, H, Saka, M, Watanabe, S, Kuroha, M & Nakano, Y 2011, Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump. in ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011, vol. 1, pp. 207-211, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011, Portland, OR, United States, 11/7/6. https://doi.org/10.1115/IPACK2011-52112

Ishikawa S, Tohmyoh H, Saka M, Watanabe S, Kuroha M, Nakano Y. Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. p. 207-211. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011). https://doi.org/10.1115/IPACK2011-52112

Ishikawa, Shoho ; Tohmyoh, Hironori ; Saka, Masumi ; Watanabe, Satoshi ; Kuroha, Motohisa ; Nakano, Yoshikatsu. / Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 2011. pp. 207-211 (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011).

@inproceedings{3455924788e74d498f217146d6f8ae36,

title = "Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump",

abstract = "Due to environmental concerns, Pb-free solders are widely used in electronic industry for assembling electronic components on the substrate. Under the various operation conditions, solder bumps are subjected to cyclic stress and failed by fatigue. To ensure the reliability of electronic products, it is becoming important to predict the fatigue failure of the Pb-free solder bumps. In this study, effects of chip size and thermal amplitude on fatigue life of the Pb-free solder bumps were investigated by experiments and elastic-plastic finite element analysis. A parameter, which is valuable to compare the fatigue damage of electronic packages with different chip size, is introduced.",

author = "Shoho Ishikawa and Hironori Tohmyoh and Masumi Saka and Satoshi Watanabe and Motohisa Kuroha and Yoshikatsu Nakano",

year = "2011",

month = dec,

day = "1",

doi = "10.1115/IPACK2011-52112",

language = "English",

isbn = "9780791844618",

series = "ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011",

pages = "207--211",

booktitle = "ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011",

note = "ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 ; Conference date: 06-07-2011 Through 08-07-2011",

}

TY - GEN

T1 - Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump

AU - Ishikawa, Shoho

AU - Tohmyoh, Hironori

AU - Saka, Masumi

AU - Watanabe, Satoshi

AU - Kuroha, Motohisa

AU - Nakano, Yoshikatsu

PY - 2011/12/1

Y1 - 2011/12/1

N2 - Due to environmental concerns, Pb-free solders are widely used in electronic industry for assembling electronic components on the substrate. Under the various operation conditions, solder bumps are subjected to cyclic stress and failed by fatigue. To ensure the reliability of electronic products, it is becoming important to predict the fatigue failure of the Pb-free solder bumps. In this study, effects of chip size and thermal amplitude on fatigue life of the Pb-free solder bumps were investigated by experiments and elastic-plastic finite element analysis. A parameter, which is valuable to compare the fatigue damage of electronic packages with different chip size, is introduced.

AB - Due to environmental concerns, Pb-free solders are widely used in electronic industry for assembling electronic components on the substrate. Under the various operation conditions, solder bumps are subjected to cyclic stress and failed by fatigue. To ensure the reliability of electronic products, it is becoming important to predict the fatigue failure of the Pb-free solder bumps. In this study, effects of chip size and thermal amplitude on fatigue life of the Pb-free solder bumps were investigated by experiments and elastic-plastic finite element analysis. A parameter, which is valuable to compare the fatigue damage of electronic packages with different chip size, is introduced.

UR - http://www.scopus.com/inward/record.url?scp=84860320438&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84860320438&partnerID=8YFLogxK

U2 - 10.1115/IPACK2011-52112

DO - 10.1115/IPACK2011-52112

M3 - Conference contribution

AN - SCOPUS:84860320438

SN - 9780791844618

T3 - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011

SP - 207

EP - 211

BT - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011

T2 - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011

Y2 - 6 July 2011 through 8 July 2011

ER -

Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump

Abstract

Publication series

Other

ASJC Scopus subject areas

Access to Document

Other files and links

Cite this