Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump

Shoho Ishikawa, Hironori Tohmyoh, Masumi Saka, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Due to environmental concerns, Pb-free solders are widely used in electronic industry for assembling electronic components on the substrate. Under the various operation conditions, solder bumps are subjected to cyclic stress and failed by fatigue. To ensure the reliability of electronic products, it is becoming important to predict the fatigue failure of the Pb-free solder bumps. In this study, effects of chip size and thermal amplitude on fatigue life of the Pb-free solder bumps were investigated by experiments and elastic-plastic finite element analysis. A parameter, which is valuable to compare the fatigue damage of electronic packages with different chip size, is introduced.

Original languageEnglish
Title of host publicationASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Pages207-211
Number of pages5
DOIs
Publication statusPublished - 2011 Dec 1
EventASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States
Duration: 2011 Jul 62011 Jul 8

Publication series

NameASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume1

Other

OtherASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
CountryUnited States
CityPortland, OR
Period11/7/611/7/8

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Ishikawa, S., Tohmyoh, H., Saka, M., Watanabe, S., Kuroha, M., & Nakano, Y. (2011). Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump. In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (pp. 207-211). (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; Vol. 1). https://doi.org/10.1115/IPACK2011-52112