TY - GEN
T1 - Effect of chip size and thermal amplitude on fatigue life of Pb-free solder bump
AU - Ishikawa, Shoho
AU - Tohmyoh, Hironori
AU - Saka, Masumi
AU - Watanabe, Satoshi
AU - Kuroha, Motohisa
AU - Nakano, Yoshikatsu
PY - 2011/12/1
Y1 - 2011/12/1
N2 - Due to environmental concerns, Pb-free solders are widely used in electronic industry for assembling electronic components on the substrate. Under the various operation conditions, solder bumps are subjected to cyclic stress and failed by fatigue. To ensure the reliability of electronic products, it is becoming important to predict the fatigue failure of the Pb-free solder bumps. In this study, effects of chip size and thermal amplitude on fatigue life of the Pb-free solder bumps were investigated by experiments and elastic-plastic finite element analysis. A parameter, which is valuable to compare the fatigue damage of electronic packages with different chip size, is introduced.
AB - Due to environmental concerns, Pb-free solders are widely used in electronic industry for assembling electronic components on the substrate. Under the various operation conditions, solder bumps are subjected to cyclic stress and failed by fatigue. To ensure the reliability of electronic products, it is becoming important to predict the fatigue failure of the Pb-free solder bumps. In this study, effects of chip size and thermal amplitude on fatigue life of the Pb-free solder bumps were investigated by experiments and elastic-plastic finite element analysis. A parameter, which is valuable to compare the fatigue damage of electronic packages with different chip size, is introduced.
UR - http://www.scopus.com/inward/record.url?scp=84860320438&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84860320438&partnerID=8YFLogxK
U2 - 10.1115/IPACK2011-52112
DO - 10.1115/IPACK2011-52112
M3 - Conference contribution
AN - SCOPUS:84860320438
SN - 9780791844618
T3 - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
SP - 207
EP - 211
BT - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
T2 - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Y2 - 6 July 2011 through 8 July 2011
ER -