Effect of Ar gas pressure on mechanical properties of sputtered Ti thin films

Hirofumi Ogawa, Kiyoteru Suzuki, Shinji Kaneko, Masumi Saka

Research output: Contribution to conferencePaper

Abstract

The effect of sputtering gas (Ar gas) pressure on the mechanical properties of free-standing Ti thin film membranes of 0.3-0.4 μm thickness, microfabricated by magnetron sputtering, has been studied by using a novel tensile testing machine. These free-standing thin film membranes are extremely difficult to handle because they are fragile. The thin film test specimens were fabricated in Si frames to protect them. Sputtering gas pressure was varied from 1.5 to 15 mT. The stress and strain of the thin films was measured continuously from elastic deformation to fracture. Both the tensile strength and the strain at fracture of the thin films were affected by the sputtering gas pressure. The tensile strength of thin films increased with decreasing gas pressure. However, there was no obvious trend between the sputtering gas pressure and Young's modulus of the thin films.

Original languageEnglish
Publication statusPublished - 1999 Dec 1
EventInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA
Duration: 1999 Jun 131999 Jun 19

Other

OtherInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999'
CityMaui, HI, USA
Period99/6/1399/6/19

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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    Ogawa, H., Suzuki, K., Kaneko, S., & Saka, M. (1999). Effect of Ar gas pressure on mechanical properties of sputtered Ti thin films. Paper presented at InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', Maui, HI, USA, .