TY - GEN
T1 - Effect of anisotropic strain field on the electronic conductance of carbon nanotubes
AU - Ohnishi, Masato
AU - Suzuki, Ken
AU - Miura, Hideo
PY - 2013/1/1
Y1 - 2013/1/1
N2 - Since carbon nanotubes (CNTs) have unique electronic and mechanical properties, there have been many efforts to develop CNTs-based electronic devices and sensors. The authors have also validated the possibility of a highly sensitive strain sensor using popular resin in which multi-walled CNTs (MWNTs) were dispersed uniformly. It is, however, indispensable for clarifying how to change the electronic state of a deformed CNT for assuring the stable performance of the sensor because the reported sensitivity has ranged widely. In this study, the relationship between the deformation characteristic of a CNT under strain and its electronic properties was analyzed. The analysis result obtained from density functional theory (DFT) calculation showed that the orbital hybridization was occurred when the maximum local dihedral angle exceeded 10-20 and 25-30 in GNRs and CNTs, respectively, which induced the band gap.
AB - Since carbon nanotubes (CNTs) have unique electronic and mechanical properties, there have been many efforts to develop CNTs-based electronic devices and sensors. The authors have also validated the possibility of a highly sensitive strain sensor using popular resin in which multi-walled CNTs (MWNTs) were dispersed uniformly. It is, however, indispensable for clarifying how to change the electronic state of a deformed CNT for assuring the stable performance of the sensor because the reported sensitivity has ranged widely. In this study, the relationship between the deformation characteristic of a CNT under strain and its electronic properties was analyzed. The analysis result obtained from density functional theory (DFT) calculation showed that the orbital hybridization was occurred when the maximum local dihedral angle exceeded 10-20 and 25-30 in GNRs and CNTs, respectively, which induced the band gap.
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U2 - 10.1115/IMECE2013-64487
DO - 10.1115/IMECE2013-64487
M3 - Conference contribution
AN - SCOPUS:84903476225
SN - 9780791856390
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
BT - Micro- and Nano-Systems Engineering and Packaging
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2013 International Mechanical Engineering Congress and Exposition, IMECE 2013
Y2 - 15 November 2013 through 21 November 2013
ER -