Effect of alloying elements on the interfacial bonding strength and electric conductivity of carbon nano-fiber reinforced Cu matrix composites

Sang Bok Lee; Katsuyuki Matsunaga; Yuichi Ikuhara; Sang Kwan Lee

doi:10.1016/j.msea.2006.02.377

Effect of alloying elements on the interfacial bonding strength and electric conductivity of carbon nano-fiber reinforced Cu matrix composites

Sang Bok Lee, Katsuyuki Matsunaga, Yuichi Ikuhara, Sang Kwan Lee

Research output: Contribution to journal › Article › peer-review

42 Citations (Scopus)

Abstract

The effect of strong carbide forming elements (Ti, Zr) in the Cu matrix on interfacial bonding and electric conductivity of CNF/Cu composites has been studied. The chemical bonding states of C/Cu interfaces were calculated by using the first-principles molecular orbital method, which showed that the presence of Ti or Zr in the interface layer strongly increases chemical bonding strength across the interface. The CNF/Cu composites with the alloying elements have been fabricated successfully by liquid infiltration process. Tensile strength of composites with additional element has been increased. However, Ti addition compared with Zr addition resulted in great loss of electric conductivity.

Original language	English
Pages (from-to)	778-781
Number of pages	4
Journal	Materials Science and Engineering A
Volume	448-451
DOIs	https://doi.org/10.1016/j.msea.2006.02.377
Publication status	Published - 2007 Mar 25

Keywords

Carbon nano-fiber
Cu composite
Electric conductivity
Interfacial bonding
Liquid infiltration

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.1016/j.msea.2006.02.377

Cite this

@article{6c744b2558c34022a2adfe0395e260ab,

title = "Effect of alloying elements on the interfacial bonding strength and electric conductivity of carbon nano-fiber reinforced Cu matrix composites",

abstract = "The effect of strong carbide forming elements (Ti, Zr) in the Cu matrix on interfacial bonding and electric conductivity of CNF/Cu composites has been studied. The chemical bonding states of C/Cu interfaces were calculated by using the first-principles molecular orbital method, which showed that the presence of Ti or Zr in the interface layer strongly increases chemical bonding strength across the interface. The CNF/Cu composites with the alloying elements have been fabricated successfully by liquid infiltration process. Tensile strength of composites with additional element has been increased. However, Ti addition compared with Zr addition resulted in great loss of electric conductivity.",

keywords = "Carbon nano-fiber, Cu composite, Electric conductivity, Interfacial bonding, Liquid infiltration",

author = "Lee, {Sang Bok} and Katsuyuki Matsunaga and Yuichi Ikuhara and Lee, {Sang Kwan}",

note = "Funding Information: This research was supported by a grant (code #: 04K1501-00710) from Center for Nanostructured Materials Technology under 21st Century frontier R&D Programs of the Ministry of Science and Technology, Korea.",

year = "2007",

month = mar,

day = "25",

doi = "10.1016/j.msea.2006.02.377",

language = "English",

volume = "448-451",

pages = "778--781",

journal = "Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing",

issn = "0921-5093",

publisher = "Elsevier BV",

}

TY - JOUR

T1 - Effect of alloying elements on the interfacial bonding strength and electric conductivity of carbon nano-fiber reinforced Cu matrix composites

AU - Lee, Sang Bok

AU - Matsunaga, Katsuyuki

AU - Ikuhara, Yuichi

AU - Lee, Sang Kwan

N1 - Funding Information: This research was supported by a grant (code #: 04K1501-00710) from Center for Nanostructured Materials Technology under 21st Century frontier R&D Programs of the Ministry of Science and Technology, Korea.

PY - 2007/3/25

Y1 - 2007/3/25

N2 - The effect of strong carbide forming elements (Ti, Zr) in the Cu matrix on interfacial bonding and electric conductivity of CNF/Cu composites has been studied. The chemical bonding states of C/Cu interfaces were calculated by using the first-principles molecular orbital method, which showed that the presence of Ti or Zr in the interface layer strongly increases chemical bonding strength across the interface. The CNF/Cu composites with the alloying elements have been fabricated successfully by liquid infiltration process. Tensile strength of composites with additional element has been increased. However, Ti addition compared with Zr addition resulted in great loss of electric conductivity.

AB - The effect of strong carbide forming elements (Ti, Zr) in the Cu matrix on interfacial bonding and electric conductivity of CNF/Cu composites has been studied. The chemical bonding states of C/Cu interfaces were calculated by using the first-principles molecular orbital method, which showed that the presence of Ti or Zr in the interface layer strongly increases chemical bonding strength across the interface. The CNF/Cu composites with the alloying elements have been fabricated successfully by liquid infiltration process. Tensile strength of composites with additional element has been increased. However, Ti addition compared with Zr addition resulted in great loss of electric conductivity.

KW - Carbon nano-fiber

KW - Cu composite

KW - Electric conductivity

KW - Interfacial bonding

KW - Liquid infiltration

UR - http://www.scopus.com/inward/record.url?scp=33847179774&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33847179774&partnerID=8YFLogxK

U2 - 10.1016/j.msea.2006.02.377

DO - 10.1016/j.msea.2006.02.377

M3 - Article

AN - SCOPUS:33847179774

VL - 448-451

SP - 778

EP - 781

JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

SN - 0921-5093

ER -

Effect of alloying elements on the interfacial bonding strength and electric conductivity of carbon nano-fiber reinforced Cu matrix composites

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this