Abstract
The electrical conductivities of Cu - 3at.%Ti alloys aged at 773 K in a hydrogen atmosphere were investigated as a function of aging time. The electrical conductivity of the quenched alloy, 5.2% International Annealed Copper Standard (IACS), improved with aging time to 66% IACS after 48 h. This was mainly caused by the dilution of the Cu-Ti solid solution in the alloy, which is supported by the fact that the lattice parameter of the face-centered cubic (fcc) phase approaches that of pure Cu by aging in a hydrogen atmosphere.
| Original language | English |
|---|---|
| Pages (from-to) | 473-477 |
| Number of pages | 5 |
| Journal | Journal of Materials Research |
| Volume | 23 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 2008 Feb |
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering