Abstract
Edge effects were investigated on the quality of resist patterns based on finite difference time domain (FDTD) calculations. The interference of the surface plasmon leads to nanoscale spatial distribution of light intensity, which reradiate into the photoresist. The edge effects can be removed by adding a layer of refractive-index-matched materials on the exit side of the mask. It was found that, depending on the thickness of the protection layer, the width of the resist pattern can be controlled.
Original language | English |
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Title of host publication | Digest of Papers - Microprocesses and Nanotechnology 2004 |
Pages | 132-133 |
Number of pages | 2 |
Publication status | Published - 2004 Dec 1 |
Externally published | Yes |
Event | 2004 International Microprocesses and Nanotechnology Conference - Osaka, Japan Duration: 2004 Oct 26 → 2004 Oct 29 |
Other
Other | 2004 International Microprocesses and Nanotechnology Conference |
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Country/Territory | Japan |
City | Osaka |
Period | 04/10/26 → 04/10/29 |
ASJC Scopus subject areas
- Engineering(all)