Dynamic scaling in electrochemical deposition

Hiroshi Iwasaki, Atsushi Iwamoto, Koichi Sudoh, Tatsuo Yoshinobu

Research output: Contribution to journalConference article

3 Citations (Scopus)

Abstract

Atomic force microscopy and numerical simulation were used to study the static and dynamic scaling behavior in copper electrochemical deposition in the stable growth condition. Two distinct scaling regimes with roughness exponent a of 0.6 and 0.87±0.05 were found. The rms surface width of the measured surface in the former regime was smaller than that in the latter regime. The sum of α + (α / β) was larger than the value expected for KPZ local growth, 2. Finally, the smoother (α = 0.6) and the rougher (0.87) surfaces were reproduced by numerical solutions of KPZ +.

Original languageEnglish
Pages (from-to)159-168
Number of pages10
JournalMaterials Research Society Symposium - Proceedings
Volume367
Publication statusPublished - 1995
EventProceedings of the 1994 MRS Fall Meeting - Boston, MA, USA
Duration: 1994 Nov 281994 Dec 1

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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