TY - GEN
T1 - Dynamic recrystallization of biomedical Co-Cr-W-Ni (L-605) alloy
AU - Favre, Julien
AU - Chiba, Akihiko
AU - Koizumi, Yuichiro
AU - Fabrègue, Damien
AU - Maire, Eric
PY - 2012
Y1 - 2012
N2 - Compression tests are carried out at high-temperature on Thermec-master Z, followed by gas quench. Microstructures after deformation are evaluated using SEM-EBSD. Significant grain refinement occurs by dynamic recrystallization for high temperature and low strain rate (T>1100°C, SR<0.1s-1), and at high strain rate (SR∼10s-1). Dynamic recrystallization is discontinuous and takes place from the grain boundaries, leading to a necklace structure. The nucleation mechanism is most likely to be bulging of grain boundaries. However, recrystallization occurs also by rotation of annealing twins. Thereafter the twin boundaries can bulge as well. The modeling of mechanical behavior gives a fair quantification of flow softening due to dynamic recrystallization indicating the progress of dynamic recrystallization with deformation.
AB - Compression tests are carried out at high-temperature on Thermec-master Z, followed by gas quench. Microstructures after deformation are evaluated using SEM-EBSD. Significant grain refinement occurs by dynamic recrystallization for high temperature and low strain rate (T>1100°C, SR<0.1s-1), and at high strain rate (SR∼10s-1). Dynamic recrystallization is discontinuous and takes place from the grain boundaries, leading to a necklace structure. The nucleation mechanism is most likely to be bulging of grain boundaries. However, recrystallization occurs also by rotation of annealing twins. Thereafter the twin boundaries can bulge as well. The modeling of mechanical behavior gives a fair quantification of flow softening due to dynamic recrystallization indicating the progress of dynamic recrystallization with deformation.
KW - Biomedical cobalt superalloy
KW - Dynamic recrystallization
KW - Forging
KW - Grain refinement
UR - http://www.scopus.com/inward/record.url?scp=84856182293&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84856182293&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.706-709.472
DO - 10.4028/www.scientific.net/MSF.706-709.472
M3 - Conference contribution
AN - SCOPUS:84856182293
SN - 9783037853030
T3 - Materials Science Forum
SP - 472
EP - 477
BT - THERMEC 2011
PB - Trans Tech Publications Ltd
T2 - 7th International Conference on Processing and Manufacturing of Advanced Materials, THERMEC'2011
Y2 - 1 August 2011 through 5 August 2011
ER -