Ductile cutting of a microstructure array on silicon surface by using a diamond tool with a negative rake angle

Yuanliu Chen, Yindi Cai, Keisuke Tohyama, Yuki Shimizu, So Ito, I Ko

Research output: Contribution to conferencePaperpeer-review

Abstract

This paper presents an experimental investigation of ductile cutting of silicon by using a diamond tool with a negative rake angle. A diamond cutting tool with a zero rake angle is inclined to form a negative rake angle for a better performance in ductile cutting. A high-sensitivity force sensor is integrated with the tool holder for detection of the tool-sample contact and monitoring the thrust force in the cutting process. The unavoidable sample tilt was probed by using the force sensor integrated diamond tool as a stylus, so that microstructures can be directly fabricated along the tilted workpiece. With accurate tilt compensation, a microstructure array with a good uniformity was successfully fabricated on the silicon surface.

Original languageEnglish
Publication statusPublished - 2015 Oct 18
Event8th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2015 - Kyoto, Japan
Duration: 2015 Oct 182015 Oct 22

Other

Other8th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2015
CountryJapan
CityKyoto
Period15/10/1815/10/22

Keywords

  • Brittle material
  • Diamond cutting
  • Force sensor
  • Nano scratching
  • Negative rake angle

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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