Discharge instability at patterned conductive layers on insulating substrates during pulsed-plasma chemical vapor deposition under near atmospheric pressures

Yohei Inayoshi, Hirokazu Fukidome, Setsuo Nakajima, Tsuyoshi Uehara, Yasutake Toyoshima, Maki Suemitsu

Research output: Contribution to journalArticle

Abstract

Discharge instability at patterned conductive layers on insulating substrates during pulsed-plasma chemical vapor deposition under near atmospheric pressures was studied by observing the distribution of plasma damage spots in the grown film. Instability of the discharge is found to be enhanced at conductive layers, and the density and the size of the plasma damage spots vary with the shape and the size of the conductive pattern. Based on these observations, we propose a simple model, uniformly diluted charge (UDC) model, to explain the damage distribution within the conductive pattern.

Original languageEnglish
Pages (from-to)47-52
Number of pages6
Journale-Journal of Surface Science and Nanotechnology
Volume11
DOIs
Publication statusPublished - 2013 Apr 6

Keywords

  • Chemical vapor deposition
  • Dielectric Barrier Discharge
  • Discharge instability
  • Plasma
  • Silicon nitride

ASJC Scopus subject areas

  • Biotechnology
  • Bioengineering
  • Condensed Matter Physics
  • Mechanics of Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

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