Direct multichip-to-wafer 3D integration technology using flip-chip self-assembly of NCF-covered known good dies

Yuka Ito, Mariappan Murugesan, Takafumi Fukushima, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

We demonstrated surface tension-driven self-assembly and microbump bonding using NCF (non-conductive film)-covered chips with Cu/Sn-Ag microbumps for highthroughput and high-yield direct multichip-to-wafer 3D integration. The NCF is a promising candidate to completely fill gaps between fine-pitch microbumps, and is essential for realizing highly-reliable microbump-to-microbump interconnections. Here, by applying the self-assembly method with strong water surface tension, the NCF-covered chips were precisely aligned to hydrophilic assembly sites defined on host Si substrates in a face-down manner with alignment accuracies of approximately 1 μm. The self-assembled chips having Cu/Sn-Ag microbumps covered with NCF were thermally compressed to obtain electrical joints between the chips and substrate after the self-assembly process. The resulting daisy chains showed good electrical characteristics with contact resistance of 53 mΩ/joint.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1148-1153
Number of pages6
ISBN (Electronic)9781479924073
DOIs
Publication statusPublished - 2014 Sep 11
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: 2014 May 272014 May 30

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period14/5/2714/5/30

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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