Abstract
Electromigration pattern of solders depends on the temperature of the material. In almost all electromigration studies of solder, the temperature of the heater used for supplying heat to the solder, or that of an atmosphere, is considered to be the electromigration temperature for characterizing the pattern. However, because of incidental local Joule heating, the actual surface temperature of the solder is different from that of the heater as well as the atmosphere. No serious attempt has yet been reported in the literature that can characterize the electromigration pattern in relation to the actual temperature of the solder. This is mainly because of the lack of a suitable method of temperature measurement for the solder surface. The present article describes a successful attempt to directly measure the local surface temperature of eutectic Pb-Sn solder for determining the electromigration pattern.
| Original language | English |
|---|---|
| Pages (from-to) | 1074-1081 |
| Number of pages | 8 |
| Journal | Journal of Electronic Materials |
| Volume | 35 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 2006 May |
Keywords
- Chemical reagents
- Electromigration
- Eutectic solder
- Local surface temperature
- Melting point
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry