Direct liquid cooling module with high reliability solder joining technology for automotive applications

Akira Morozumi, Hiroaki Hokazono, Yoshitaka Nishimura, Yoshinari Ikeda, Yoichi Nabetani, Yoshikazu Takahashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

19 Citations (Scopus)

Abstract

We developed the direct-liquid-cooling IGBT module which enabled downsizing of a power control unit for HEV system and high reliability simultaneously. This module eliminates thermal grease by unifying a ceramic substrate and a heat sink. It contributes this module realized the reduction of thermal resistance 30 % compared to the conventional indirect liquid cooling type. High thermal conductive Si3N4 ceramics for the substrate and lightweight aluminum heat sink that are suitable for automotive use demand are applied. The technological challenge of this module is to overcome the decrease of the reliability of the joint by large CTE mismatch between substrate and heat sink. We developed the Sn-Sb based solder material which can attain high reliability for automotive use with large CTE mismatch components. And IGBT module with this new solder is applied to HEV.

Original languageEnglish
Title of host publication2013 25th International Symposium on Power Semiconductor Devices and IC's, ISPSD 2013
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages109-112
Number of pages4
ISBN (Print)9781467351348
DOIs
Publication statusPublished - 2013 Jan 1
Externally publishedYes
Event2013 25th International Symposium on Power Semiconductor Devices and IC's, ISPSD 2013 - Kanazawa, Japan
Duration: 2013 May 262013 May 30

Publication series

NameProceedings of the International Symposium on Power Semiconductor Devices and ICs
ISSN (Print)1063-6854

Other

Other2013 25th International Symposium on Power Semiconductor Devices and IC's, ISPSD 2013
CountryJapan
CityKanazawa
Period13/5/2613/5/30

ASJC Scopus subject areas

  • Engineering(all)

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