Direct evidence of fcc-type miscibility gap in the Cu-Ni-V system at high temperatures

Yan Yu, Cuiping Wang, Xingjun Liu, Ryosuke Kainuma, Kiyohito Ishida

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

This work firstly presents detailed evidence of the fcc-type miscibility gap in the Cu-Ni-V system at temperatures between 1000 °C and 1100 °C. The phase equilibria, phase transformation behavior and microhardness of the (Cu0.5Ni0.5)100-xVx (at.%) (x=2, 4, 6, 8, 10, 12) alloys have been investigated by electron probe microanalysis, X-ray diffraction, differential scanning calorimetry and Vickers hardness tester, confirming that the fcc-type miscibility gap exists in the Cu-Ni-V system at temperatures between 1000 °C and 1100 °C. The obtained results will not only help to well understand the strengthening mechanisms in the Cu-Ni-V alloys at high temperatures, but also to effectively develop new high-temperature spinodalhardened Cu-Ni-V base alloys in the future.

Original languageEnglish
Pages (from-to)247-249
Number of pages3
JournalMaterials Letters
Volume65
Issue number2
DOIs
Publication statusPublished - 2011 Jan 31

Keywords

  • Hardness
  • Metals and alloys
  • Microstructure
  • Phase diagrams
  • X-ray techniques

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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