Diode integrated capacitive accelerometer with reduced structural distortion

Y. Shoji, M. Yosida, K. Minami, Masayoshi Esashi

Research output: Contribution to conferencePaperpeer-review

5 Citations (Scopus)

Abstract

This paper describes the development of diode integrated capacitive accelerometer with reduced structural distortion. To obtain high sensitivity in capacitive sensors, narrow capacitor gaps are needed. To realize such narrow capacitor gaps, it is important to reduce a structural distortion during anodic bonding process. We studied the anodic bonding process to reduce the structural distortion, and found that it is effective to use thick glass and optimum bonding temperature. The accelerometer has a surrounding seismic mass suspended with four thin beams formed in the middle of the wafer thickness. A diode-bridge circuit to detect differential capacitances was integrated on the silicon chip.

Original languageEnglish
Pages581-584
Number of pages4
Publication statusPublished - 1995 Dec 1
EventProceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Part 1 (of 2) - Stockholm, Sweden
Duration: 1995 Jun 251995 Jun 29

Other

OtherProceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Part 1 (of 2)
CityStockholm, Sweden
Period95/6/2595/6/29

ASJC Scopus subject areas

  • Engineering(all)

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