Diffusion-fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing

Shien Ri, Masumi Saka

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Abstract

To enhance atomic diffusion and accumulation by utilizing the stress migration phenomenon, the diffusion-fatigue interaction effect on hillock formation in high-purity aluminum thin films under thermal cycle testing was investigated. Thermal cycle tests were performed from room temperature to 220°C on an Al thin film with a purity of 99.99% for three different heat treatments; annealing as well as high-cycle and low-cycle testing. The experimental results showed that the diffusion-fatigue effect could significantly increase the amount of atomic diffusion and the density of formed hillocks compared with conventional pure constant heating. The diffusion-fatigue interaction mechanism was explained by the atomic flux divergence formula.

Original languageEnglish
Pages (from-to)139-141
Number of pages3
JournalMaterials Letters
Volume79
DOIs
Publication statusPublished - 2012 Jul 15

Keywords

  • Aluminum
  • Atomic diffusion
  • Heat treatment
  • Stress migration
  • Thermal fatigue

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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