Diagram of electromigration pattern in eutectic Pb-Sn and Pb-free solders

T. Hasegawa, M. Saka

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)


Solder is the most frequently used alloy, which serves as the bonding metal for electronics components. Recently, the interconnected bump is distinctly downsizing its bulk along with the integration of high-density packaging. The evaluation of electromigration damage for solder bumps is indispensable. Hence, it is fairly urgent to understand the mechanism of the electromigration damage to be capable of securing reliability of the solder bump and ultimately predicting its failure lifetime. Electromigration pattern in multi-phase material is determined by the combination of current density, temperature and current-applying time. In this paper, diagram of electromigration pattern (DEP) in solders is presented, where both of eutectic Pb-Sn and Pb-free solders are treated. DEP gives the basis for discussing and predicting the electromigration damage in solders.

Original languageEnglish
Pages (from-to)837-843
Number of pages7
JournalKey Engineering Materials
Volume297-300 II
Publication statusPublished - 2005


  • Current density
  • Current-applying time
  • Electromigration pattern
  • Multi-phase
  • Solder
  • Temperature

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering


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