Development trends in the field of wafer bonding technologies

Maik Wiemer, Marco Haubold, Chenping Jia, Dirk Wünsch, J. Frömel, Thomas Geßner

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

One well established technology for the fabrication of 3D devices in microelectronics and micro system technology is wafer bonding. After an overview about the existing bonding techniques the presentation will address aspects like bonding with plasma pretreatment to reduce the bond temperature below 200°C, use of nanostructures for bonding, metal to metal bonding and integration of new materials to form special SOI substrates.

Original languageEnglish
Title of host publicationECS Transactions - Semiconductor Wafer Bonding 10
Subtitle of host publicationScience, Technology, and Applications
PublisherElectrochemical Society Inc.
Pages81-92
Number of pages12
Edition8
ISBN (Print)9781566776547
DOIs
Publication statusPublished - 2008 Jan 1
Externally publishedYes
EventSemiconductor Wafer Bonding 10: Science, Technology, and Applications - 214th ECS Meeting - Honolulu, HI, United States
Duration: 2008 Oct 142008 Oct 16

Publication series

NameECS Transactions
Number8
Volume16
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

OtherSemiconductor Wafer Bonding 10: Science, Technology, and Applications - 214th ECS Meeting
CountryUnited States
CityHonolulu, HI
Period08/10/1408/10/16

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Development trends in the field of wafer bonding technologies'. Together they form a unique fingerprint.

Cite this