Development of wiring boards using single-layer adsorption films and their recycle method

Yuji Suzuki, Masaru Nakagawa, Tomokazu Iyoda

Research output: Contribution to conferencePaperpeer-review

Abstract

We developed a novel method for recycling wiring polymer boards using a layer-by-layer multilayer of colloidal SiO2 particles as a separation layer on a PET substrate. A plating-promotion layer of poly(4-vinyl pyridine-co-1-dodecyl-4-vinylpyridinium bromide)(QP4VP) was adsorbed on the colloidal SiO2 multilayer and patterned by vacuum ultraviolet light irradiation through a photomask. Selective Cu deposition occurred in accordance with the QP4VP photopattern shape and Cu wiring boards could be prepared. The Cu wiring boards were separated readily due to dissolving SiO2 particle by an alkali NaOH solution. It was found that the colloidal SiO2 multilayer was available for the separation layer of wiring boards.

Original languageEnglish
Number of pages1
Publication statusPublished - 2005 Dec 1
Externally publishedYes
Event54th SPSJ Annual Meeting 2005 - Yokohama, Japan
Duration: 2005 May 252005 May 27

Other

Other54th SPSJ Annual Meeting 2005
CountryJapan
CityYokohama
Period05/5/2505/5/27

Keywords

  • Electroless plating
  • Layer-by-layer
  • Recycle
  • Sigle-layer adsorption film
  • Wiring board

ASJC Scopus subject areas

  • Engineering(all)

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