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Development of wafer6 level chip size packaging process and its application to the CMOS image sensor module for medical device
Noriyuki Fujimori, Takatoshi Igarashi, Takahiro Shimohata, Takuro Suyama, Kazuhiro Yoshida, Yusuke Nakagawa, Tsutomu Nakamura, Toshiro Sato
Research output: Contribution to journal › Article › peer-review