Development of wafer6 level chip size packaging process and its application to the CMOS image sensor module for medical device

Noriyuki Fujimori, Takatoshi Igarashi, Takahiro Shimohata, Takuro Suyama, Kazuhiro Yoshida, Yusuke Nakagawa, Tsutomu Nakamura, Toshiro Sato

Research output: Contribution to journalArticlepeer-review

Abstract

A new packaging technique has been realized and applied to the imaging module for medical endoscope. In order to realize minimal invasiveness for in-vivo medical device applications, the WL-CSP (Wafer Level-Chip Size Package) is one of the most attractive technology. However, in the field of medical device packaging, the packaging needs are diversified and required number of each package does not meet the huge sized wafer processing. In this new technique, the CMOS image sensor wafer is diced at first, and then individual image sensor chips are rearranged on another smaller handling wafer. As a result, suitable size of the handling wafer can be selected for the production volume, and lower production cost and shorter production lead time can be achieved. The packaged image sensor with new packaging technique showed no significant degration of charactristic of image sensor.

Original languageEnglish
Pages (from-to)48-58
Number of pages11
JournalIEEJ Transactions on Sensors and Micromachines
Volume137
Issue number2
DOIs
Publication statusPublished - 2017

Keywords

  • 3D package
  • CMOS image sensor
  • TSV
  • WL-CSP

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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