Development of three-dimensional integration technology for highly parallel image-processing chip

Kang Wook Lee, Tomonori Nakamura, Katsuyuki Sakuma, Ki Tae Park, Hiroaki Shimazutsu, Nobuaki Miyakawa, Ki Yoon Kim, Hiroyuki Kurino, Mitsumasa Koyanagi

Research output: Contribution to journalArticlepeer-review

48 Citations (Scopus)

Fingerprint Dive into the research topics of 'Development of three-dimensional integration technology for highly parallel image-processing chip'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science