Development of thermodynamic tool "ADAMIS/Pandat" and its application in design of micro-soldering materials

Ikuo Ohnuma, Xing Jun Liu, Ryosuke Kainuma, Hiroshi Ohtani, Shang Lin Chen, Y. Austin Chang, Kiyohito Ishida

Research output: Contribution to conferencePaper

Abstract

A thermodynamic tool, ADAMIS/Pandat (Alloy Database for Micro-Solder), has been developed for designing micro-soldering materials. ADAMIS database is based on comprehensive experimental and thermodynamic data accumulated with the CALPHAD method and contains 8 elements; Ag, Bi, Cu, In, Pb, Sb, Sn and Zn, which supports all combination of these elements and all composition ranges. ADAMIS database is integrated with the multi-component phase diagram calculation software, Pandat, and offers a user-friendly interface with ability to calculate the liquidus projection, isothermal and isopleth sectional diagrams, thermodynamic properties, etc. It also has functions to calculate surface tension and viscosity of liquid phase. Furthermore, non-equilibrium solidification simulation of multi-component alloys can be simulated using the Scheil model. In comparison with the equilibrium solidification, the formation of the liquid phase due to segregation in the Scheil calculation increases the freezing range. The addition of Bi strongly causes liquid formation at low temperature.

Original languageEnglish
Pages897-903
Number of pages7
Publication statusPublished - 2003 Dec 1
Event58th Congresso Anual da ABM (Associacao Brasileira de Metalurgia e Materiais) - Rio de Janeiro, Brazil
Duration: 2003 Jul 212003 Jul 24

Other

Other58th Congresso Anual da ABM (Associacao Brasileira de Metalurgia e Materiais)
CountryBrazil
CityRio de Janeiro
Period03/7/2103/7/24

Keywords

  • Calphad
  • Lead-free solder
  • Thermodynamic database

ASJC Scopus subject areas

  • Metals and Alloys

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  • Cite this

    Ohnuma, I., Liu, X. J., Kainuma, R., Ohtani, H., Chen, S. L., Chang, Y. A., & Ishida, K. (2003). Development of thermodynamic tool "ADAMIS/Pandat" and its application in design of micro-soldering materials. 897-903. Paper presented at 58th Congresso Anual da ABM (Associacao Brasileira de Metalurgia e Materiais), Rio de Janeiro, Brazil.