TY - JOUR
T1 - Development of thermodynamic and kinetic databases in micro-soldering alloy systems and their applications
AU - Liu, Xing Jun
AU - Wang, Cui Ping
AU - Ohnuma, Ikuo
AU - Kainuma, Ryosuke
AU - Ishida, Kiyohito
N1 - Funding Information:
Foundation item: Project( 51031003 ) supported by the National Natural Science Foundation of China ; Projects( 2009DFA52170, 2009AA03Z101 ) supported by the Ministry of Science and Technology of China ; Project( 2009I0024 ) supported by Fujian Provincial Department of Science and Technology ; Project( 3502Z20093001 ) supported by Xiamen City Department of Science and Technology
Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2011/4
Y1 - 2011/4
N2 - Recent progress in the development of thermodynamic and kinetic databases of micro-soldering alloys, which were constructed within the framework of the Thermo-Calc and DICTRA software, was presented. Especially, a thermodynamic tool, ADAMIS (alloy database for micro-solders) was developed by combining the thermodynamic databases of micro-solders with Pandat, a multi-component phase diagram calculation software program. ADAMIS contains 11 elements, namely, Ag, Al, Au, Bi, Cu, In, Ni, Sb, Sn, Zn and Pb, and can handle all combinations of these elements in the whole composition range. The obtained thermodynamic and kinetic databases can not only provide much valuable thermodynamic information such as phase equilibria and phase fraction, but also shows the kinetics and the evolution of microstructures when they are combined with some appropriate software programs and models, such as the phase field method and ADSTEFAN software. From the viewpoints of computational thermodynamics and kinetics, some technical examples were given to demonstrate the great utility of these databases for the applications in the development of micro-soldering materials. These databases are expected to be powerful tools for the development of micro-solders and Cu substrate materials, as well as for promoting the understanding of interfacial phenomena and microstructure evolution between solders and substrates in electronic packaging technology.
AB - Recent progress in the development of thermodynamic and kinetic databases of micro-soldering alloys, which were constructed within the framework of the Thermo-Calc and DICTRA software, was presented. Especially, a thermodynamic tool, ADAMIS (alloy database for micro-solders) was developed by combining the thermodynamic databases of micro-solders with Pandat, a multi-component phase diagram calculation software program. ADAMIS contains 11 elements, namely, Ag, Al, Au, Bi, Cu, In, Ni, Sb, Sn, Zn and Pb, and can handle all combinations of these elements in the whole composition range. The obtained thermodynamic and kinetic databases can not only provide much valuable thermodynamic information such as phase equilibria and phase fraction, but also shows the kinetics and the evolution of microstructures when they are combined with some appropriate software programs and models, such as the phase field method and ADSTEFAN software. From the viewpoints of computational thermodynamics and kinetics, some technical examples were given to demonstrate the great utility of these databases for the applications in the development of micro-soldering materials. These databases are expected to be powerful tools for the development of micro-solders and Cu substrate materials, as well as for promoting the understanding of interfacial phenomena and microstructure evolution between solders and substrates in electronic packaging technology.
KW - Kinetics
KW - Micro-soldering alloys
KW - Thermodynamics
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U2 - 10.1016/S1002-0071(12)60042-2
DO - 10.1016/S1002-0071(12)60042-2
M3 - Article
AN - SCOPUS:84861992624
VL - 21
SP - 97
EP - 110
JO - Progress in Natural Science: Materials International
JF - Progress in Natural Science: Materials International
SN - 1002-0071
IS - 2
ER -