Development of thermodynamic and kinetic databases in micro-soldering alloy systems and their applications

Xing Jun Liu, Cui Ping Wang, Ikuo Ohnuma, Ryosuke Kainuma, Kiyohito Ishida

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

Recent progress in the development of thermodynamic and kinetic databases of micro-soldering alloys, which were constructed within the framework of the Thermo-Calc and DICTRA software, was presented. Especially, a thermodynamic tool, ADAMIS (alloy database for micro-solders) was developed by combining the thermodynamic databases of micro-solders with Pandat, a multi-component phase diagram calculation software program. ADAMIS contains 11 elements, namely, Ag, Al, Au, Bi, Cu, In, Ni, Sb, Sn, Zn and Pb, and can handle all combinations of these elements in the whole composition range. The obtained thermodynamic and kinetic databases can not only provide much valuable thermodynamic information such as phase equilibria and phase fraction, but also shows the kinetics and the evolution of microstructures when they are combined with some appropriate software programs and models, such as the phase field method and ADSTEFAN software. From the viewpoints of computational thermodynamics and kinetics, some technical examples were given to demonstrate the great utility of these databases for the applications in the development of micro-soldering materials. These databases are expected to be powerful tools for the development of micro-solders and Cu substrate materials, as well as for promoting the understanding of interfacial phenomena and microstructure evolution between solders and substrates in electronic packaging technology.

Original languageEnglish
Pages (from-to)97-110
Number of pages14
JournalProgress in Natural Science: Materials International
Volume21
Issue number2
DOIs
Publication statusPublished - 2011 Apr

Keywords

  • Kinetics
  • Micro-soldering alloys
  • Thermodynamics

ASJC Scopus subject areas

  • Materials Science(all)

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