Development of the next generation Si wafer transfer/stock system

Yukihiro Kanechika; Takashi Kawaguchi; Takashi Kawaguchi; Toshihiko Jimbo; Masahiro Yamasaki; Masaki Hirayama; Yasuyulu Shirai; Tadahiro Ohmi

doi:10.1109/ISSM.2001.963023

Development of the next generation Si wafer transfer/stock system

Yukihiro Kanechika, Takashi Kawaguchi, Takashi Kawaguchi, Toshihiko Jimbo, Masahiro Yamasaki, Masaki Hirayama, Yasuyulu Shirai, Tadahiro Ohmi

New Industry Creation Hatchery Center (NICHe)

Research output: Contribution to journal › Article › peer-review

Abstract

Clean room air contains many kinds of contaminants such as moisture and organic compounds. The device performance is influenced on them, therefore, Si wafer should not be exposed to clean room air. We have developed the next generation Si wafer transfer/stock system using the out-gas free advanced resin and CDA (Clean Dry Air). The advanced resin has various advantageous properties for Si wafer transfer box and stocker. For example, (1)out-gas free, (2)light weight, (3)high transparency, (4)high strength, etc. Using the advanced resin, we have developed a newly Si wafer transfer pod, called BORP(Bottom Opening Removal Pod).

Original language	English
Pages (from-to)	495-498
Number of pages	4
Journal	IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings
DOIs	https://doi.org/10.1109/ISSM.2001.963023
Publication status	Published - 2001

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Engineering(all)
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/ISSM.2001.963023

Fingerprint Dive into the research topics of 'Development of the next generation Si wafer transfer/stock system'. Together they form a unique fingerprint.

Cite this

Development of the next generation Si wafer transfer/stock system. / Kanechika, Yukihiro; Kawaguchi, Takashi; Kawaguchi, Takashi; Jimbo, Toshihiko; Yamasaki, Masahiro; Hirayama, Masaki ; Shirai, Yasuyulu; Ohmi, Tadahiro.

In: IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings, 2001, p. 495-498.

Research output: Contribution to journal › Article › peer-review

@article{c63f0212a4d346d4808acb5b04c007dd,

title = "Development of the next generation Si wafer transfer/stock system",

abstract = "Clean room air contains many kinds of contaminants such as moisture and organic compounds. The device performance is influenced on them, therefore, Si wafer should not be exposed to clean room air. We have developed the next generation Si wafer transfer/stock system using the out-gas free advanced resin and CDA (Clean Dry Air). The advanced resin has various advantageous properties for Si wafer transfer box and stocker. For example, (1)out-gas free, (2)light weight, (3)high transparency, (4)high strength, etc. Using the advanced resin, we have developed a newly Si wafer transfer pod, called BORP(Bottom Opening Removal Pod).",

author = "Yukihiro Kanechika and Takashi Kawaguchi and Takashi Kawaguchi and Toshihiko Jimbo and Masahiro Yamasaki and Masaki Hirayama and Yasuyulu Shirai and Tadahiro Ohmi",

year = "2001",

doi = "10.1109/ISSM.2001.963023",

language = "English",

pages = "495--498",

journal = "ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings",

issn = "1523-553X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - JOUR

T1 - Development of the next generation Si wafer transfer/stock system

AU - Kanechika, Yukihiro

AU - Kawaguchi, Takashi

AU - Jimbo, Toshihiko

AU - Yamasaki, Masahiro

AU - Hirayama, Masaki

AU - Shirai, Yasuyulu

AU - Ohmi, Tadahiro

PY - 2001

Y1 - 2001

N2 - Clean room air contains many kinds of contaminants such as moisture and organic compounds. The device performance is influenced on them, therefore, Si wafer should not be exposed to clean room air. We have developed the next generation Si wafer transfer/stock system using the out-gas free advanced resin and CDA (Clean Dry Air). The advanced resin has various advantageous properties for Si wafer transfer box and stocker. For example, (1)out-gas free, (2)light weight, (3)high transparency, (4)high strength, etc. Using the advanced resin, we have developed a newly Si wafer transfer pod, called BORP(Bottom Opening Removal Pod).

AB - Clean room air contains many kinds of contaminants such as moisture and organic compounds. The device performance is influenced on them, therefore, Si wafer should not be exposed to clean room air. We have developed the next generation Si wafer transfer/stock system using the out-gas free advanced resin and CDA (Clean Dry Air). The advanced resin has various advantageous properties for Si wafer transfer box and stocker. For example, (1)out-gas free, (2)light weight, (3)high transparency, (4)high strength, etc. Using the advanced resin, we have developed a newly Si wafer transfer pod, called BORP(Bottom Opening Removal Pod).

UR - http://www.scopus.com/inward/record.url?scp=0035165718&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035165718&partnerID=8YFLogxK

U2 - 10.1109/ISSM.2001.963023

DO - 10.1109/ISSM.2001.963023

M3 - Article

AN - SCOPUS:0035165718

SP - 495

EP - 498

JO - ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

JF - ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

SN - 1523-553X

ER -