Development of silicon microcapacitive accelerometer for seismic measurement

Mitsutomo Nishizawa, Geunbae Lim, Hiroaki Niitsuma, Masayoshi Esashi

Research output: Contribution to journalConference article

3 Citations (Scopus)

Abstract

We have developed a high sensitive and wide-band micro capacitive accelerometer for subsurface seismic measurements by using the micro machining technique which enables to fabricate three-dimensional micro structure and to realize small-size, low-cost and high performance sensors or actuators. The silicon capacitive micro accelerometers, which are used in automobiles for suspension control, brake control and air bags, are potentially be used for subsurface seismic measurements. However the sensitivity and the bandwidth of existing sensors are insufficient to detect seismic waves. The micro machining technique which we employed includes photolithography, anisotropic etching, reactive ion etching and anodic bonding. Problems in the fabrication process such as sticking of silicon mass on the electrode, buckling of spring beams, and a problem due to the squeezed film dumping effect have been resolved by improving the sensor structure and the silicon process. Finally, we have evaluated the characteristics of the sensor.

Original languageEnglish
Pages (from-to)125-132
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3752
Publication statusPublished - 1999 Dec 1
EventProceedings of the 1999 Subsurface Sensors and Applications - Denver, CO, USA
Duration: 1999 Jul 191999 Jul 21

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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