Development of self-assembled 3-D integration technology and study of microbump and TSV induced stress in thinned chip/wafer

Tetsu Tanaka, Takafumi Fukushima, Kanuku Ri, M. Murugesan, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
Original languageEnglish
Title of host publication2010 IEEE International SOI Conference, SOI 2010
DOIs
Publication statusPublished - 2010 Dec 30
Event2010 IEEE International Silicon on Insulator Conference, SOI 2010 - San Diego, CA, United States
Duration: 2010 Oct 112010 Oct 14

Publication series

NameProceedings - IEEE International SOI Conference
ISSN (Print)1078-621X

Other

Other2010 IEEE International Silicon on Insulator Conference, SOI 2010
CountryUnited States
CitySan Diego, CA
Period10/10/1110/10/14

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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