@inproceedings{ef8fbc7fc425466caff7ad89a687ee0b,
title = "Development of self-assembled 3-D integration technology and study of microbump and TSV induced stress in thinned chip/wafer",
author = "Tetsu Tanaka and Takafumi Fukushima and Kanuku Ri and M. Murugesan and Mitsumasa Koyanagi",
year = "2010",
month = dec,
day = "30",
doi = "10.1109/SOI.2010.5641471",
language = "English",
isbn = "9781424491285",
series = "Proceedings - IEEE International SOI Conference",
booktitle = "2010 IEEE International SOI Conference, SOI 2010",
note = "2010 IEEE International Silicon on Insulator Conference, SOI 2010 ; Conference date: 11-10-2010 Through 14-10-2010",
}